Microelectronic packaging architectures applications (18 résultats)

Etat : New.

Etat : New.

Etat : As New. Unread book in perfect condition.

Etat : New.

Etat : New. In English.

Taschenbuch. Etat : Neu. 3D Microelectronic Packaging | From Architectures to Applications | Yan Li (u. a.) | Taschenbuch | Springer Series in Advanced Microelectronics | xvii | Englisch | 2021 | Springer | EAN 9789811570926 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Etat : As New. Unread book in perfect condition.

Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.…

Buch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.…

Etat : New. 2nd ed. 2021 edition NO-PA16APR2015-KAP.

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Hardcover. Etat : Brand New. 2nd edition. 639 pages. 9.25x6.10x1.50 inches. In Stock.

Hardcover. Etat : New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Gebunden. Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides comprehensive coverage of 3D microelectronic packages Explains the fundamentals of using solder interconnects as micro-bumps Demonstrates the advanced materials and processes used in 3D microelectronic packages Introd.…

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Etat : New. Print on Demand This item is printed on demand.

Etat : New. PRINT ON DEMAND.

Etat : New. PRINT ON DEMAND.