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Ajouter au panierXXX, 735 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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Ajouter au panierPaperback. Etat : Brand New. 436 pages. 8.98x6.06x1.02 inches. In Stock.
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Ajouter au panierHardcover. Etat : Good. Satisfaction 100% guaranteed.
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Ajouter au panierEtat : New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
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Ajouter au panierGebunden. Etat : New. Dr. EPHRAIM SUHIR is Fellow of the IEEE, ASME, APS, IoP (UK), and the SPE. He is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine cofounder of the ASME Journal of Electronic Packaging holds twenty-two U.S. patents and has.
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Ajouter au panierTaschenbuch. Etat : Neu. Moisture Sensitivity of Plastic Packages of IC Devices | X. J. Fan (u. a.) | Taschenbuch | Micro- and Opto-Electronic Materials, Structures, and Systems | xiv | Englisch | 2012 | Springer | EAN 9781461426257 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Ajouter au panierEtat : As New. Unread book in perfect condition.
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Ajouter au panierEtat : New. pp. 590.
Langue: anglais
Edité par Springer US, Springer US, 2010
ISBN 10 : 1441957189 ISBN 13 : 9781441957184
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
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Ajouter au panierBuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Langue: anglais
Edité par Springer US, Springer US, 2012
ISBN 10 : 1461426251 ISBN 13 : 9781461426257
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
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Ajouter au panierTaschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Langue: anglais
Edité par Springer-Verlag New York Inc., 2012
ISBN 10 : 1461426251 ISBN 13 : 9781461426257
Vendeur : Revaluation Books, Exeter, Royaume-Uni
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Ajouter au panierPaperback. Etat : Brand New. 572 pages. 9.20x6.10x1.33 inches. In Stock.
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Ajouter au panierHardcover. Etat : Brand New. 570 pages. 9.25x6.25x1.25 inches. In Stock.
Vendeur : Brook Bookstore On Demand, Napoli, NA, Italie
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Ajouter au panierEtat : new. Questo è un articolo print on demand.
Vendeur : Brook Bookstore On Demand, Napoli, NA, Italie
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Ajouter au panierEtat : new. Questo è un articolo print on demand.
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
EUR 213,99
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Ajouter au panierTaschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike. 588 pp. Englisch.
Vendeur : moluna, Greven, Allemagne
EUR 223,97
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Ajouter au panierEtat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presented in a systematic manner based on lectures and tutorials by the authorsFocused on improved reliability in plastic packagingProvides theory and new industry applicationsMoisture Sensitivity of Plastic Packages of IC Devices provides information o.