integrated circuit process (100 résultats)

XVI, 249 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Sprache: Englisch.

Hardcover. Etat : Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 1.8.

Paperback. Etat : Very Good. 4to, paperback. Vg condition. Ex-lib copy w/ light markings to opening pgs, spine label neatly removed; spine mildly smudged, contents bright & clean, binding tight. 553 p.

Etat : New. In.

Taschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a structured and comprehensive pathway through the complexities of Electronic Design Automation (EDA) tools and processes. It focuses on OpenLane and Caravel EDA tools, due to their current major role in the open-source IC design ecosystem. OpenLane provides a robust and flexible platform that automates the entire digital design flow from Register Transfer Level (RTL) to Graphic Data System II (GDSII), making it an ideal tool for teaching and learning the physical design process. Caravel, on the other hand, serves as an open-source System on a Chip (SoC) platform, allowing designers to integrate and test their designs in a versatile, real-world environment. It complements OpenLane by enabling users to package and validate their designs, bridging the gap between theoretical knowledge and practical implementation. Together, these tools provide a way to understand the full tape-out process in a way that is accessible to students, researchers, and professionals alike.

Paperback. Etat : Very Good. No Jacket. 1st. W/full markings and pocket. Wear, Soil. Will not fit in Flat Rate Priority Mail envelope. USPS Variable Rate applies for Domestic or International. Ex-Library Size: 4to. Ex-Library.

Soft cover. Etat : Very Good. No Jacket. 1st Edition. Has all standard Library markings, pocket, labels, stamps, wear and soil to covers. CLEAN TEXT. Thank you for your purchase from Sunset Books! Help Promote World Literacy, GIVE a Book as a GIFT!! In stock, Ships from Ohio. Will not fit in Flat Rate Priority Mail envelope. USPS Variable Rate applies for Domestic or International Priority mail. WE COMBINE SHIPPING ON MULTIPLE PURCHASES!!!! Size: 4to. Ex-Library.

Soft cover. Etat : Good. No Jacket. 1st Edition. wear/soil. W/full markings, bookplate and/or pocket. Has some wave to pages from improper storage. Will not fit in Flat Rate Priority Mail envelope. USPS Variable Rate applies for Domestic or International. Size: 4to. Ex-Library.

Soft cover. Etat : Good. No Jacket. 1st Edition. wear/soil. W/full markings, bookplate and/or pocket. Has some wave to pages from improper storage. Will not fit in Flat Rate Priority Mail envelope. USPS Variable Rate applies for Domestic or International. Ex-Library Size: 4to. Ex-Library.

Paperback. Etat : Very Good. No Jacket. 1st. ORIGINAL, NOT A REPRINT OR PHOTOCOPY!! NO Dust Jacket. Has or May Have all standard Library markings, pocket, labels, stamps, wear and soil to covers. CLEAN TEXT! See Picture! The Copyright date is 1993 for this Printing. This volume was purchased through DMRO from the Wright-Patterson Technical Library in the late 1990's. Thank you for your purchase from Sunset Books! Help Promote World Literacy, GIVE a Book as a GIFT!! In stock, Ships from Ohio. Will not fit in Flat Rate Priority Mail envelope. USPS Variable Rate applies for Domestic or International. WE COMBINE SHIPPING ON MULTIPLE PURCHASES!!!! SEE PICTURES!!!!! ANY ODD/GREEN TONES ON THE SCANS ARE CAUSED BY MY SCANNER!! All of our Technical/Textbook/Ex-Library volumes were obtained legally through Public or Auction sales. This volume was purchased through Local Public Auction. All of our Technical/Textbook/Ex-Library volumes were obtained legally through Public or Auction sales. This volume was purchased through DMRO from the Wright-Patterson Technical Library in the late 1990's. Size: 4to. Ex-Library.

Etat : New. In.

paperback. Etat : New. Paperback. Pub Date: 2023-08 Pages: 272 Publisher: Chemical Industry Press Chips are integrated circuits packaged in tubes and shells. Electronic products that can be seen everywhere in modern life are inseparable from various chips. So. how are powerful chips made? Let's follow this book to find out! The Illustrated Integrated Circuit Manufacturing Process first introduces the development history of the semiconductor industry in a relaxed and interesting language; then divides the entire chi.

paperback. Etat : New. Language:Chinese.Paperback. Pub Date: 2023-12 Pages: 416 Publisher: Machinery Industry Press This book focuses on both theory and practice. providing readers with theoretical and practical guidance for the full process design of CMO analog integrated circuits. as well as background knowledge and important theoretical analysis related to the design process. and is accompanied by relevant design training. including specific cases and the operation and use of EDA software. This book builds a com.

Hardcover. Etat : Bon. Ancien livre de bibliothèque. Traces d'usure sur la couverture. Salissures sur la tranche. Jaquette abîmée. Edition 1977. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Good. Former library book. Signs of wear on the cover. Stains on the edge. Damaged dust jacket. Edition 1977. Ammareal gives back up to 15% of this item's net price to charity organizations.

Hardcover. Etat : New.

paperback. Etat : New. Paperback. Pub Date: 2023-01 Pages: 423 Language: Chinese Publisher: Tsinghua University Press Plasma Etching and Its Application in Large-Scale Integrated Circuit Manufacturing (2nd Edition) (High-end Integrated Circuit Manufacturing Process Series) has 10 chapters. which comprehensively introduces the application and potential development direction of low-temperature plasma etching technology in the semiconductor industry based on public literature. It starts with the development history of.

paperback. Etat : New. Paperback. Pub Date: 2011 Pages: 220 in Publisher: Publishing House of Electronics Industry Electronic Information and Electrical disciplines planning materials (Electronic Science and Technology. professional): integrated circuit process design and process simulation. introduced the contemporary system-level IC design The front end. the back end of the placement and routing process to achieve the three main components of an overall technology development. a focus on the computer simulation a.

Hardcover. Etat : New.

paperback. Etat : New. Language:Chinese.Paperback. Pub Date: 2023-06 Publisher: Donghua University Press The book is divided into 3 chapters. with a total of 26 experiments. Chapter 1 is the basic process. including vacuum technology. cleaning and oxidation of silicon wafers. experimental teaching of photolithography process flow. oxygen plasma etching. plasma enhanced chemical vapor deposition. magnetron sputtering to prepare metal films. and atomic layer deposition to prepare nanofilms. Experimental principles an.

Hardcover. Etat : UsedGood. Hardcover; fading and shelf wear to exterior; former owner's name written on front endpaper; fading to pages; in good condition with clean text, firm binding. Dust jacket shows fading, scuffing, and small edge tears.

Soft cover. Etat : Very Good. 329 pages in very good condition. SPIE Proceedings Series Volume 775. Pages are clean and unmarked with black and white illustrations and diagrams throughout. Page edges are lightly smudged. Bound in yellow wraps with black titles. Previous owner's initials on the upper cover and spine. Lightly worn around the edges. Marked on the lower cover. Wrinkled and torn on the spine. VG Size: 8 1/2 x 11. Book.

paperback. Etat : New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2009-11-01 Language: Chinese Publisher: Tsinghua University Press Product Name : Integrated circuit (IC) manufacturing process On the application of new materials and high-tech in the books author : Tian Min Bo ISBN Number: 9787302209591 Publisher: Tsinghua University Press. commodity type : Book published :2009 -11-01 printing :2009 -12-01 [Description] This book is written in simple language and vivid . pictorial form . a brief introduction of the integrated circuit man.Four Satisfaction guaranteed,or money back.

paperback. Etat : New. Language:Chinese.Paperback. Pub Date: 2024-01 Pages: 162 Publisher: Machinery Industry Press Semiconductor Dry Etching Technology (Original Book 2nd Edition) is a comprehensive and systematic treatise on dry etching technology. For dry etching technology. the content covers from basic knowledge to the latest technology. allowing beginners to understand the mechanism of dry etching without complex numerical formulas or equations. Semiconductor Dry Etching Technology (2nd Edition of the Origina.

Soft cover. Etat : Near Fine. 528 pages in near fine condition. Volume IV, covering the year 1990. Pages are clean and unmarked with black and white illustrations throughout. Page edges are lightly smudged. Bound in yellow card covers with black titles. Lightly worn around the edges. Wrinkled and marked on the spine. Some marks and creases on the lower cover. NF Size: 8 /12 x 11. Book.

paperback. Etat : New. Language:Chinese.Paperback. Pub Date: 2023-02-01 Publisher: Xidian University Press This book is based on the book Microelectronics Manufacturing Technology (published by Xidian University Press) edited by the editor in 2009. combining ten It is compiled based on years of experience in the teaching of microelectronics manufacturing technology in higher vocational education. The whole book takes silicon-based integrated circuit planar technology as the main line. taking into account other proc.

Soft cover. Etat : Very Good. 697 pages in very good condition. SPIE Proceedings Series Volume 1673. Pages are clean and unmarked with black and white diagrams and illustrations throughout. Page edges are lightly smudged. Bound in yellow wraps with black titles. Lightly wrinkled and smudged on the spine, light wear around the edges. VG Size: 8 1/2 x 11. Book.

Soft cover. Etat : Very Good. 535 pages in very good condition. SPIE Proceedings Series Volume 1087. Pages are clean and unmarked with black and white diagrams and illustrations throughout. Page edges are lightly smudged. Bound in yellow wraps with black titles. Spine is wrinkled and smudged. Lightly worn around the edges. VG Size: 8 1/2 x 11. Book.

Soft cover. Etat : Very Good. 535 pages in very good condition. Volume III, covering the year 1989. Pages are clean and unmarked with black and white illustrations throughout. Page edges are lightly smudged. Bound in yellow card covers with black titles. Some markings on the upper cover and spine. Spine is wrinkled. Lightly worn around the edges. VG Size: 8 1/2 x 11. Book.

Soft cover. Etat : New. Language:Chinese.Author:DAI WEI SI (Jeffrey A.Davis) DENG.Binding:Soft cover.Publisher:Mechanical Industry Press Pub. Date :2010-08-01.

paperback. Etat : New. Paperback. Pub Date: 2019-10-01 Pages: 76 Language: Chinese Publisher: Science Press in the integrated circuit industry. chip manufacturing technology is one of the core aspects of the industry chain. China Research topics chip integrated circuit manufacturing process electronic information engineering technology development. made from the perspective of trying to chip large-scale production. introduce key single chip manufacturing workers .