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Ajouter au panierHardcover. Etat : Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Ajouter au panierhardcover. Etat : New. In shrink wrap. Looks like an interesting title!
Vendeur : Hard To Find Editions, Bristol, AVON, Royaume-Uni
Edition originale
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Ajouter au panierHardcover. Etat : Very Good. 1st Edition. This book has been read, but is in a clean and very good condition. All pages are intact with no highlighting or writing contained within. The spine remains undamaged with tight binding. Fast dispatch within and from the UK. 100% money back guarantee.
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Vendeur : Lucky's Textbooks, Dallas, TX, Etats-Unis
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Vendeur : Lucky's Textbooks, Dallas, TX, Etats-Unis
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Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
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Vendeur : GreatBookPricesUK, Woodford Green, Royaume-Uni
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Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
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Ajouter au panierHardcover. Etat : new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks.
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Ajouter au panierTaschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical 'glue' of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Vendeur : GreatBookPricesUK, Woodford Green, Royaume-Uni
EUR 299,91
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Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
EUR 290,43
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Ajouter au panierHardcover. Etat : Like New. Like New. book.
Edité par Florence, Kentucky, U.S.A.: Van Nostrand Reinhold, 1991
ISBN 10 : 0442002602 ISBN 13 : 9780442002602
Langue: anglais
Vendeur : Bingo Books 2, Vancouver, WA, Etats-Unis
EUR 321,04
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Ajouter au panierHardcover. Etat : Near Fine. hardback book in near fine condition,name stamped on first blank page.
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Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
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Ajouter au panierPaperback. Etat : Brand New. 652 pages. 9.30x6.20x1.40 inches. In Stock.
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EUR 336,21
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EUR 315,74
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Ajouter au panierBuch. Etat : Neu. Neuware - Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical 'glue' of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.