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Etat : New. pp. 332.

Etat : New. Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of def.

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Paperback. Etat : Brand New. reprint edition. 329 pages. 10.00x7.01x0.75 inches. In Stock.

Buch. Etat : Neu. Neuware - Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an 'International Workshop on Designing for Yield' at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the 'IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems' in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.…

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Taschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an 'International Workshop on Designing for Yield' at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the 'IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems' in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21. 332 pp. Englisch.…

Etat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of def.…

Taschenbuch. Etat : Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an 'International Workshop on Designing for Yield' at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the 'IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems' in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.…

Taschenbuch. Etat : Neu. This item is printed on demand - Print on Demand Titel. Neuware -Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an 'International Workshop on Designing for Yield' at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the 'IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems' in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 332 pp. Englisch.…

Etat : New. Print on Demand pp. 332 66:B&W 7 x 10 in or 254 x 178 mm Perfect Bound on White w/Gloss Lam.

Etat : New. PRINT ON DEMAND pp. 332.

Etat : New. Print on Demand pp. 336 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Etat : New. PRINT ON DEMAND pp. 336.