Microelectronic packaging (152 résultats)

Etat : Good. 1st Edition. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Saddle-stapled. Etat : Good. Periodical. [132]pp [faint dampstain to front portion of magazine, with mild wrinkling] Larry Long and Diana DeAre - THE SLOWING OF URBANIZATION IN THE U.S.; Vincent Courtillot and Gregory E. Vink - HOW CONTINENTS BREAK UP; Lauren R. Donaldson and Timothy Joyner - THE SALMONID FISHES AS A NATURAL LIVESTOCK; Daniel L. Alkon - LEARNING IN A MARINE SNAIL; Albert J. Blodgett, Jr. - MICROELECTRONIC PACKAGING; Donald R. Kaplan - THE DEVELOPMENT OF PALM LEAVES; Nariman B. Mistry. - PARTICLES WITH NAKED BEAUTY; Derek Bickerton - CREOLE LANGUAGES Size: 4to - over 9¾" - 12" tall. Color and b&w illustrations (illustrateur).…

Hardcover. Etat : UsedGood. Hardcover; surplus library copy with the usual stampings and reference numb er written on the spine; fading and shelf wear to exterior; bumps to the up per corners; otherwise in good condition with clean text and tight binding.

hardcover. Etat : Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Hardcover. Etat : Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Trade paperback. Very good. No dust jacket as iss.

hardcover. Etat : Acceptable. Connecting readers with great books since 1972. Used textbooks may not include companion materials such as access codes, etc. May have condition issues including wear and notes/highlighting. We ship orders daily and Customer Service is our top priority.

Hardcover. Etat : Very Good. ex-company library,in near very good condition.

Etat : Very Good. Used - Very Good.

Etat : Acceptable. SHIPS FAST. RESCUED + REPAIRED. Features a small coffee mishap, plus a reinforced binding, secured cover, and light annotations or highlighting-a durable, fully readable working copy brought back to life at a great value by our Book Sustainability Project. No access codes or CDs.

Hardcover. Etat : Very Good. 2. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.

Hardcover. Etat : Very Good. Sorry, No international shipping on this item.Ex-Library hardcover in very nice condition with all the usual markings and attachments. Text block clean and unmarked. Tight binding.

Etat : very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships USPS Media Mail.…

Hardcover. Etat : Very Good. Book is in very nice condition, text is unmarked and pages are tight.

Hardcover. Etat : Good. Etat de la jaquette : Very Good. Ex navy library with shelving sticker on spine, circulation record of front pastedown, stamps on front pastedown and ffep. Interior and exterior else in VG condition, clean, tight, and unmarked. DJ has no library markings, minor rubbing and wear to corners and edges. International shipping billed at cost. Photos upon request. Please note that the buyer is responsible for any customs duties, tariffs, or import fees levied by the destination country.; 8vo 8" - 9" tall; 377 pages.…

hardcover. Etat : Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority.

149 figs., VIII, 178 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Microtechnology and Mems. Sprache: Englisch.…

Paperback. Etat : New.

Etat : Like New. Page block firm and clean, binding unblemished, boards straight, without markings of any kind. Fine, like new condition. Extremely fine. Previous owners name on the inside of front endpaper. Well packaged and promptly shipped from California. Partnered with Friends of the Library since 2010.…

Hardcover. Etat : Fair. Book in Fair condition.

Hardcover. Etat : Good. Book in Good condition.

Hardcover. Etat : Gut. Ehem. Bibliotheksexemplar mit Bib.-Signatur und Stempel in GUTEM Zustand. Kaum Gebrauchsspuren. Sprache: Englisch Gewicht in Gramm: 550.

Etat : New. In English.

(S. A. Sci. American Vol. 249, No. 1) 1983. S. 1 - 12. gr8. m. zahlr. Abb. br. -2) Sonderabdruck Offprint.

Etat : Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Hardcover. 1st. 8vo. 377pp. Bibliography. Index. Illustrations. Review copy. Fine in fine dustjacket.

Etat : New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

1ST EDITION. NEAR FINE IN DUSTWRAP. 377 PAGES. ILLUSTRATED WITH DIAGRAMS.

Hardcover. Etat : Sehr gut. 1. Auflage. Unread book in excellent condition. Language - English. Ships from Berlin. - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.…

paperback. Etat : New. Language:Chinese.Paperback. Publisher: Science out.