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Ajouter au panierHardcover. Etat : Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Langue: anglais
Edité par Springer International Publishing, Springer Nature Switzerland, 2018
ISBN 10 : 3319847198 ISBN 13 : 9783319847191
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
EUR 139,09
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Ajouter au panierTaschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Langue: anglais
Edité par Springer International Publishing, Springer Nature Switzerland, 2017
ISBN 10 : 3319516965 ISBN 13 : 9783319516967
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
EUR 139,09
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Ajouter au panierBuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
EUR 190,39
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Ajouter au panierHardcover. Etat : Brand New. 172 pages. 9.25x6.25x0.50 inches. In Stock.
Langue: anglais
Edité par Springer International Publishing, Springer Nature Switzerland Jun 2018, 2018
ISBN 10 : 3319847198 ISBN 13 : 9783319847191
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
EUR 139,09
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Ajouter au panierTaschenbuch. Etat : Neu. Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to ¿RF and Microwave Microelectronics Packaging¿ (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
Langue: anglais
Edité par Springer International Publishing, Springer Nature Switzerland Mär 2017, 2017
ISBN 10 : 3319516965 ISBN 13 : 9783319516967
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
EUR 139,09
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Ajouter au panierBuch. Etat : Neu. Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to ¿RF and Microwave Microelectronics Packaging¿ (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
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Ajouter au panierPaperback. Etat : New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Ajouter au panierEtat : Sehr gut. Zustand: Sehr gut | Seiten: 285 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
Langue: anglais
Edité par Springer New York, Springer US, 2014
ISBN 10 : 1489983244 ISBN 13 : 9781489983244
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
EUR 164,49
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Ajouter au panierTaschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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Ajouter au panierBuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Vendeur : GreatBookPricesUK, Woodford Green, Royaume-Uni
EUR 234,39
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Ajouter au panierEtat : As New. Unread book in perfect condition.
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Ajouter au panierPaperback. Etat : Like New. Like New. book.
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Ajouter au panierEtat : As New. Unread book in perfect condition.
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
EUR 139,09
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Ajouter au panierTaschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. 304 pp. Englisch.
Langue: anglais
Edité par Springer International Publishing, Springer Nature Switzerland Mär 2017, 2017
ISBN 10 : 3319516965 ISBN 13 : 9783319516967
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
EUR 139,09
Quantité disponible : 2 disponible(s)
Ajouter au panierBuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. 188 pp. Englisch.
Langue: anglais
Edité par Springer International Publishing, Springer Nature Switzerland Jun 2018, 2018
ISBN 10 : 3319847198 ISBN 13 : 9783319847191
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
EUR 139,09
Quantité disponible : 2 disponible(s)
Ajouter au panierTaschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. 188 pp. Englisch.
Langue: anglais
Edité par Springer International Publishing, 2018
ISBN 10 : 3319847198 ISBN 13 : 9783319847191
Vendeur : moluna, Greven, Allemagne
EUR 118,61
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Ajouter au panierEtat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Ken Kuang is President of Torrey Hills Technologies, LLC, a leader in the supply of quality microelectronics packaging components. From 2004-2013, Kuang led Torrey Hills to rank #188 in INC500 Fast Growing Private Companies in America and rank #2 in Sa.
Langue: anglais
Edité par Springer International Publishing, 2017
ISBN 10 : 3319516965 ISBN 13 : 9783319516967
Vendeur : moluna, Greven, Allemagne
EUR 118,61
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Ajouter au panierEtat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysisBridges the gap between low cost commercial and hi-res RF/Microwave packaging technologiesEngages in an in-depth discussion of challenges in .
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
EUR 160,49
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Ajouter au panierBuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. 285 pp. Englisch.