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Ajouter au panierHardcover. Etat : Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Ajouter au panierEtat : New. pp. 184.
Langue: anglais
Edité par Springer International Publishing, Springer Nature Switzerland Jun 2018, 2018
ISBN 10 : 3319847198 ISBN 13 : 9783319847191
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
EUR 139,09
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Ajouter au panierTaschenbuch. Etat : Neu. Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to ¿RF and Microwave Microelectronics Packaging¿ (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
Langue: anglais
Edité par Springer International Publishing, Springer Nature Switzerland Mär 2017, 2017
ISBN 10 : 3319516965 ISBN 13 : 9783319516967
Vendeur : buchversandmimpf2000, Emtmannsberg, BAYE, Allemagne
EUR 139,09
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Ajouter au panierBuch. Etat : Neu. Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to ¿RF and Microwave Microelectronics Packaging¿ (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
Langue: anglais
Edité par Springer International Publishing, Springer Nature Switzerland, 2018
ISBN 10 : 3319847198 ISBN 13 : 9783319847191
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
EUR 139,09
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Ajouter au panierTaschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Langue: anglais
Edité par Springer International Publishing, Springer Nature Switzerland, 2017
ISBN 10 : 3319516965 ISBN 13 : 9783319516967
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
EUR 139,09
Quantité disponible : 1 disponible(s)
Ajouter au panierBuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
EUR 191,20
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Ajouter au panierHardcover. Etat : Brand New. 172 pages. 9.25x6.25x0.50 inches. In Stock.
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Ajouter au panierEtat : New. pp. 304.
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Ajouter au panierEtat : Sehr gut. Zustand: Sehr gut | Seiten: 285 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
Langue: anglais
Edité par Springer New York, Springer US, 2014
ISBN 10 : 1489983244 ISBN 13 : 9781489983244
Vendeur : AHA-BUCH GmbH, Einbeck, Allemagne
EUR 164,49
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Ajouter au panierTaschenbuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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Ajouter au panierBuch. Etat : Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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EUR 235,35
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Ajouter au panierEtat : As New. Unread book in perfect condition.
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Ajouter au panierEtat : As New. Unread book in perfect condition.
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
EUR 139,09
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Ajouter au panierTaschenbuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. 304 pp. Englisch.
Langue: anglais
Edité par Springer International Publishing, Springer Nature Switzerland Mär 2017, 2017
ISBN 10 : 3319516965 ISBN 13 : 9783319516967
Vendeur : BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Allemagne
EUR 139,09
Quantité disponible : 2 disponible(s)
Ajouter au panierBuch. Etat : Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. 188 pp. Englisch.