Vendeur : Solr Books, Lincolnwood, IL, Etats-Unis
EUR 67,38
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Ajouter au panierEtat : very_good. This books is in Very good condition. There may be a few flaws like shelf wear and some light wear.
Vendeur : HPB-Red, Dallas, TX, Etats-Unis
EUR 120,34
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Ajouter au panierHardcover. Etat : Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Vendeur : Buchpark, Trebbin, Allemagne
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Ajouter au panierEtat : Sehr gut. Zustand: Sehr gut | Seiten: 352 | Sprache: Englisch | Produktart: Bücher | Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent.
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
EUR 160,06
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Ajouter au panierEtat : New. In.
Vendeur : Ria Christie Collections, Uxbridge, Royaume-Uni
EUR 220,01
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Ajouter au panierEtat : New. In.
Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
EUR 222,87
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Ajouter au panierHardcover. Etat : Like New. Like New. book.
Vendeur : Revaluation Books, Exeter, Royaume-Uni
EUR 303,40
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Ajouter au panierPaperback. Etat : Brand New. 2nd edition. 349 pages. 9.10x6.10x0.90 inches. In Stock.
Vendeur : Revaluation Books, Exeter, Royaume-Uni
EUR 305,58
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Ajouter au panierHardcover. Etat : Brand New. 2nd edition. 328 pages. 9.25x6.25x0.75 inches. In Stock.
Vendeur : Mispah books, Redhill, SURRE, Royaume-Uni
EUR 293,18
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Ajouter au panierPaperback. Etat : Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Vendeur : Brook Bookstore On Demand, Napoli, NA, Italie
EUR 166,29
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Ajouter au panierEtat : new. Questo è un articolo print on demand.
Vendeur : moluna, Greven, Allemagne
EUR 180,07
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Ajouter au panierEtat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Wide coverage of topics in test engineeringUnique defect-oriented focus of the materialsIntroduction to yield engineering common practicesThe 2nd edition of defect oriented testing has been extensively updated. New cha.
Vendeur : moluna, Greven, Allemagne
EUR 180,07
Quantité disponible : Plus de 20 disponibles
Ajouter au panierEtat : New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Wide coverage of topics in test engineeringUnique defect-oriented focus of the materialsIntroduction to yield engineering common practicesThe 2nd edition of defect oriented testing has been extensively updated. New cha.